Thin film transistor array panel and method for manufacturing the same

ABSTRACT

A manufacturing method of a thin film transistor (TFT) includes forming a gate electrode including a metal that can be combined with silicon to form silicide on a substrate and forming a gate insulation layer by supplying a gas which includes silicon to the gate electrode at a temperature below about 280° C. The method further includes forming a semiconductor on the gate insulation layer, forming a data line and a drain electrode on the semiconductor and forming a pixel electrode connected to the drain electrode.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.11/930,536 filed on Oct. 31, 2007, which claims priority to KoreanPatent Application No. 10-2007-0012634 filed on Feb. 7, 2007, thedisclosures of which are each hereby incorporated herein by referencesherein in their entireties.

BACKGROUND OF THE INVENTION

(a) Technical Field

The present disclosure relates to a thin film transistor array panel anda manufacturing method thereof.

(b) Description of the Related Art

In general, flat panel displays, such as liquid crystal displays (LCDs),organic light emitting diode (OLED) displays, and the like, include aplurality of pairs of field generating electrodes and an electro-opticalactive layer interposed therebetween. LCDs include a liquid crystallayer as the electro-optical active layer, whereas the OLED displaysinclude an organic emission layer as the electro-optical active layer.

One of the pair of the field generating electrodes is typicallyconnected to a switching element to receive an electrical signal, andthe electro-optical active layer converts the electrical signal into anoptical signal for displaying an image.

Flat panel displays use thin film transistors (TFTs), which arethree-terminal elements as the switching elements, gate lines fortransmitting scan signals that control the TFTs, and data lines fortransmitting signals through the TFTs to pixel electrodes formed on thedisplay.

As the area of a display device increases, the number of signal linesmay be increased, and accordingly resistance thereof may also beincreased. The increase of resistance may in turn cause a signal delayor a voltage drop, and therefore the signal lines may need to be made ofa material having low resistivity, such as for example copper (Cu).

However, when the signal line is made of copper, silane (SiH4) gas mayreact with the surface of a copper (Cu) line during a process of formingan insulating layer on the copper line, and accordingly copper-silicide(Cu-silicide) is formed, thereby causing the copper layer to becontaminated. At a high temperature, the copper-silicide (Cu-silicide)becomes unstable and thus repeats decomposition and composition, andaccordingly the thickness of the copper-silicide (Cu-silicide) increasesbecause silicon (Si) decomposed from the copper-silicide (Cu-silicide)is continuously diffused, thereby increasing the resistance of thecopper line.

Therefore, when copper is used as the signal line, a capping layer madeof a refractory metal such as, for example, molybdenum or an alloythereof is formed to cover the copper line so as to prevent the copperline from reacting with silicon (Si).

However, when the capping layer is further formed on the upper portionof the copper line, while unique characteristics of low resistivitywiring can be maintained, manufacturing time may be increased forforming a multi-layer.

SUMMARY OF THE INVENTION

Exemplary embodiments of the present invention provide a manufacturingmethod of a liquid crystal display (LCD) using a copper signal linehaving the benefits of forming copper-silicide on an upper portion ofthe copper signal line, thereby preventing resistance of the coppersignal line from being increased. In accordance with an exemplaryembodiment of the present invention, a manufacturing method of a thinfilm transistor (TFT) is provided. The method includes forming a gateelectrode including a metal that can be combined with silicon to formsilicide on a substrate, forming a gate insulation layer by supplying agas which includes silicon to the gate electrode at a temperature belowabout 280° C., forming a semiconductor on the gate insulation layer,forming a data line and a drain electrode on the semiconductor andforming a pixel electrode connected to the drain electrode.

The gate line may comprise copper, and the gate insulating layer may becomprise silicon nitride (SiN_(x)).

The forming of the gate insulation layer may be performed at atemperature of about 220° C. to about 280° C., and when forming the gateinsulation layer, the temperature of the substrate may be about 220° C.to about 250° C.

The manufacturing method may further include forming a passivation layerby supplying a gas which includes silicon at a temperature of less thanor equal to about 280° C. after forming the data line and the drainelectrode.

In accordance with an exemplary embodiment of the present invention, amanufacturing method is provided. The method includes: forming a gateelectrode including a metal that can be combined with silicon to formsilicide, forming a first silicon nitride layer on the gate electrode bysupplying a gas which includes silicon and a gas which includes nitrogenand forming a second silicon nitride layer by supplying a gas whichincludes silicon and a gas which includes nitrogen on the first siliconnitride layer, wherein a flow amount ratio of the two gases is differentfrom a flow amount ratio supplied for forming the first silicon nitridelayer. The method further includes forming a semiconductor on the secondsilicon nitride layer, forming a data line and a drain electrode on thesemiconductor and forming a pixel electrode connected to the drainelectrode. Moreover, a [N—H]/[Si—H] binding number ratio of the secondsilicon nitride layer may be less than that of the first silicon nitridelayer.

The gate line may comprise copper.

The first silicon nitride layer may have a thickness of about 50 toabout 600 Å. A [N—H]/[Si—H] binding number ratio of the first siliconnitride layer may be about 40, and a [N—H]/[Si—H] binding number ratioof the second silicon nitride layer may be about 1.5 to about 2.5.

In accordance with an exemplary embodiment of the present invention, athin film transistor array panel (TFT) is provided. The TFT includes agate electrode, a semiconductor, a gate insulation layer, source anddrain electrodes, and a pixel electrode. The gate electrode includes ametal that can be combined with silicon to form silicide. Thesemiconductor is formed under or over the gate electrode. The gateinsulation layer is formed between the gate electrode and thesemiconductor. The source and drain electrodes contact thesemiconductor. The pixel electrode is connected to the drain electrode.The gate insulation layer includes a first silicon nitride layer and asecond silicon nitride layer interposed between the first siliconnitride layer and the semiconductor, and a [N—H]/[Si—H] binding numberratio of the first silicon nitride layer is greater than that of thesecond silicon nitride layer.

The [N—H]/[Si—H] binding number ratio of the first silicon nitride layermay be about 20 to about 40, and the [N—H]/[Si—H] binding number ratioof the second silicon nitride layer may be about 1.5 to about 2.5.

The TFT array panel may further include a passivation layer formed onthe source electrode and the drain electrode, the passivation layerincludes a third silicon nitride layer and a fourth silicon nitridelayer interposed between the third silicon nitride layer and the pixelelectrode, and a [N—H]/[Si—H] binding number ratio of the third siliconnitride layer may be greater than that of the fourth silicon nitridelayer.

In accordance with an exemplary embodiment of the present invention, athin film transistor array (TFT) panel is provided. The TFT includes agate electrode, a semiconductor, a gate insulation layer, source anddrain electrodes, and a pixel electrode. The gate electrode includes ametal that can be combined with silicon to form silicide. Thesemiconductor is formed under or over the gate electrode. The gateinsulation layer is interposed between the gate electrode and thesemiconductor and includes silicon nitride. The source and drainelectrodes contact the semiconductor. The pixel electrode is connectedto the drain electrode. The gate insulation layer includes a contactunit that contacts the gate electrode, a channel unit that contacts thesemiconductor, and a middle unit interposed between the contact unit andthe channel unit. Moreover, the contact unit and the middle unit havedifferent [N—H]/[Si—H] binding number ratios.

The [N—H]/[Si—H] binding number ratio of the contact unit may be greaterthan that of the middle unit, and the [N—H]/[Si—H] binding number ratioof the contact unit may be about 20 to about 40 and the [N—H]/[Si—H]binding number ratio of the middle unit may be about 1.5 to about 2.5.

The [N—H]/[Si—H] binding number ratios of the contact unit and thechannel unit may be greater than that of the middle unit, the[N—H]/[Si—H] binding number ratios of the contact unit and the channelunit may be about 20 to about 40, and the [N—H]/[Si—H] binding numberratio of the middle unit may be about 1.5 to about 2.5.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the present invention can be understood in moredetail from the following description taken in conjunction with theaccompanying drawings, in which:

FIG. 1 and FIG. 2 are graphs showing component analysis results of asilicon nitride (SiN_(x)) layer deposited on a copper line at about 250°C. and at about 320° C., respectively.

FIG. 3 is a layout view of a thin film transistor (TFT) array panelaccording to an exemplary embodiment of the present invention.

FIG. 4 and FIG. 5 are cross-sectional views of the TFT array panel ofFIG. 3, taken along lines IV-IV and V-V.

FIG. 6, FIG. 11, FIG. 14, and FIG. 17 are cross-sectional viewssequentially illustrating a manufacturing process of the TFT array panelaccording to an exemplary embodiment of the present invention.

FIG. 7 and FIG. 8 are cross-sectional views of the TFT of FIG. 6, takenalong lines VII-VII and VII-VII, respectively.

FIG. 9 and FIG. 10 are cross-sectional views respectively illustratingthe TFT array panel of FIG. 7 and FIG. 8 in the next stage of themanufacturing process.

FIG. 12 and FIG. 13 are cross-sectional views respectively illustratingthe TFT array panel of FIG. 11, taken along lines XII-XII and XIII-XIII.

FIG. 15 and FIG. 16 are cross-sectional views respectively illustratingof the TFT array panel of FIG. 14, taken along lines XV-XV and XVI-XVI.

FIG. 18 and FIG. 19 are cross-sectional views respectively illustratingthe TFT array panel of FIG. 17, taken along lines XVIII-XVIII andXIX-XIX.

FIG. 20 and FIG. 21 are graphs showing component analysis results in acase in which a N-rich silicon nitride (SiN_(x)) thin film is depositedon an exposed copper line and a case in which a typical silicon nitride(SiN_(x)) layer is deposited.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS OF THE INVENTION

The present invention will be described more fully hereinafter withreference to the accompanying drawings, in which exemplary embodimentsof the invention are shown. As those skilled in the art would realize,the described embodiments may be modified in various different ways, allwithout departing from the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc.,are exaggerated for clarity. Like reference numerals designate likeelements throughout the specification. It will be understood that whenan element such as a layer, film, region, or substrate is referred to asbeing “on” another element, it can be directly on the other element orintervening elements may also be present. In contrast, when an elementis referred to as being “directly on” another element, there are nointervening elements present.

Exemplary Embodiment 1

In a process of forming an insulation layer including silicon in anupper portion of a copper line, a method for controlling resistance ofthe copper line by controlling a chemical vapor deposition (CVD)temperature will be described in further detail.

Table 1 and Table 2 respectively show Gibbs free energy that occurs whencopper oxide (CuO or Cu₂O) and silane (SiH₄ react with each other andthus they are decomposed into copper (Cu) and silicon (Si). Herein, thecopper is quickly oxidized when it is exposed to air so that it formscopper oxide, and therefore pure copper hardly meets a silane (SiH₄)gas.

TABLE 1 Absolute Cu0 + SiH₄═ temperature K CuO + SiH₄ CuSi − H₂0 + H₂Cu + Si + H₂0 − H₂ 298.15 −295.474 −352.625 −157.151 300 −295.932−353.313 −157.381 400 −222.054 −392.274 −170.12 500 −256.66 −433.834−183.174 600 −281.431 −477.781 −196.35 700 −314.152 −523.673 −209.521800 −348-647 −571.266 −222.629 900 −384.77 −620.378 −235.608

TABLE 2 Absolute 2Cu + Si—H₂0 + Cu₂0 + SiH₄═ temperature K Cu₂O + SiH₄H₂ 2Cu + Si + H₂0 + H₂ 298.15 −221.95 −362.513 −140.563 300 −225.501−363.262 −137.761 400 −253.927 −405.828 −148.901 500 −291.346 −451.832−160.486 600 −328.375 −500.643 −172.268 700 −367.731 −551.843 −184.112800 −409.196 −605.131 −195.935 900 −452.583 −660.283 −207.68

As shown in Table 1 and Table 2, the Gibbs free energy that occurs whenthe copper oxide CuO and Cu₂O and the silane SiH₄ react with each otherand they are decomposed into copper Cu and silicon Si has a negativevalue, and this implies that a reaction voluntarily occurs. As thetemperature increases, the Gibbs free energy has a larger negativevalue, and therefore the copper oxide and the silane react better at ahigher temperature. However, when the copper oxides CuO and Cu₂O, andthe silane SiH₄ are reacted and decomposed into Cu and Si, Si and Cu arebonded, thereby forming copper-silicide.

Therefore, when the insulation layer including silicon is deposited onthe copper line at a relatively low temperature, the copper oxide CuOand silane SiH₄ reaction and decomposition into Cu and Si can besuppressed, thereby preventing copper-silicide from being formed, andaccordingly the resistance increase of the copper line can be prevented.

When a silicon nitride (SiN_(x)) layer is formed on a glass substratehaving a copper line with a variation of temperature in a chamber,composition of the silicon nitride layer and the copper line are variedas shown in FIG. 1 and FIG. 2.

FIG. 1 and FIG. 2 are graphs respectively showing composition analysisresults for a silicon nitride (SiN_(x)) layer deposited on the copperline at about 250° C. and at about 320° C. by using secondary ion massspectrometry (SIMS).

The about 250° C. and about 320° C. respective represent glass substratetemperatures.

In the graphs of FIG. 1 and FIG. 2, the vertical axis denotes a timeduring which a sputtering process is performed to the substrate as atarget on which the silicon nitride layer and the copper line areformed. That is, when the substrate is used as the target for thesputtering process, components positioned on a surface of the siliconnitride layer are removed by plasma at an initial stage of thesputtering process, and components positioned deeper from the surface ofthe silicon nitride layer are removed as a sputter time lapses.Therefore, in FIG. 1 and FIG. 2, the depth from the insulating layersurface and time are proportional to each other, and the sputtering timeincreases as the depth from the insulating layer surface increases.

In addition, in FIG. 1 and FIG. 2, curved lines are suddenly changed atan interface portion of the silicon nitride insulating layer and thecopper line.

As shown in FIG. 1 and FIG. 2, when the silicon nitride layer isdeposited at about 250° C., the amount of silicon (Si) is moresignificantly decreased from the Cu/SiN_(x) interface than when thesubstrate is deposited at about 320° C. When the silicon nitride isdeposited at about 250° C., silicon is not deeply diffused into thecopper line, and in this case, a change of formation of copper-silicideis reduced, thereby preventing the resistance of the copper line frombeing increased.

In the first exemplary embodiment, the temperature of the glasssubstrate is about 250° C., but the processing temperature of a chambermay be about 250° C. to about 280° C.

In addition, as described above, the copper oxide and the silane reactbetter at a higher temperature, and therefore when the glass substratetemperature is less than about 250° C., that is, when the processingtemperature of the chamber is less than about 280° C., the diffusion ofthe silicon can be more reduced, thereby more decreasing the resistanceof the copper line. In this case, the temperature of the glass substrateis preferably about 220° C. to about 250° C., and the chambertemperature is preferably about 220° C. to about 280° C.

However, the quality of the layer may be deteriorated and processingtime may be increased when the temperature for deposition of the siliconnitride layer is decreased, and therefore the deposition temperaturecannot be limitlessly decreased.

That is, when the temperature is too low, the quality of the depositedinsulating layer is deteriorated so that it cannot act as either adielectric layer or a passivation layer. Therefore, it is important todecrease the temperature while preventing the layer quality from beingdeteriorated.

The following table 3 shows a comparison of a resistance of gate wiringand characteristics of a thin film transistor in which a gate insulationlayer is deposited at about 250° C. on gate wiring that is made ofcopper and in which a thin film transistor (TFT) is formed after thegate insulation layer is deposited on the gate wiring made of copper atabout 320° C.

TABLE 3 Resistance Ωη after CVD Cu line forming Resistance depositionGlass resistance insulation Ωηafter conditions No. Ωη layer annealingOn-current A Off-current A On/Off ratio 320° C. 1 2.35 3.13 3.137.09E−06 4.36E−13 1.63E+07 320° C. 2 2.35 2.78 2.82 7.37E−06 5.84E−131.26E+07 320° C. 3 2.37 2.75 3.10 7.77E−06 6.29E−13 1.24E+07 320° C. 42.34 2.89 3.11 7.83E−06 6.65E−13 1.18E+07 320° C. 5 2.37 3.10 3.127.69E−06 6.43E−13 1.20E+07 320° C. 6 2.34 2.92 3.11 7.50E−06 9.22E−138.13E+07 250° C. 1 2.38 2.19 2.18 3.87E−06 2.30E−13 1.68E+07 250° C. 22.27 2.11 2.09 4.03E−06 2.83E−13 1.42E+07 250° C. 3 2.41 2.21 2.203.88E−06 2.99E−13 1.30E+07 250° C. 4 2.33 2.15 2.13 4.11E−06 3.03E−131.36E+07 250° C. 5 2.42 2.22 2.21 3.90E−06 3.73E−13 1.05E+07 250° C. 62.40 2.23 2.21 3.99E−06 4.61E−13 8.66E+07

As shown in Table 3, after a copper line is formed, resistance values ofthe copper line at an early stage are similar to each other within arange between about 2.279 Ωm to about 2.42 Ωm. When the CVD temperatureis about 320° C., the resistance values are between about 2.82 Ωm toabout 3.13 Ωm after a transistor is formed, and when the CVD temperatureis about 250° C., the resistance values are between about 2.09 Ωm toabout 2.21 Ωm after the transistor is formed. That is, the depositionconditions may significantly affect the resistance values of the copperline.

When the CVD temperature is about 250° C., an on-current of thetransistor is reduced to 4 E-06 A from a range of about 7 E-06 A toabout 8 E-06 A compared to when the CVD temperature is about 320° C.However, the transistor can be sufficiently driven when the on-off ratiois greater than only about 1 E+06. As shown in Table 3, as the on-offratio is about 8 E+06 to about 1.5 E+07 at about 250° C., the transistorcan be sufficiently driven.

Therefore, when the gate insulation layer is deposited at about 250° C.,the resistance of the gate wiring can be reduced without causing damagewhen driving the transistor.

A thin film transistor (TFT) array panel according to an exemplaryembodiment of the present invention will be described in further detailwith reference to FIG. 3 to FIG. 5.

FIG. 3 is a layout view of a TFT array panel according to an exemplaryembodiment of the present invention, and FIG. 4 and FIG. 5 arecross-sectional views of the TFT array panel of FIG. 3, taken linesIV-IV and V-V, respectively.

A plurality of gate lines 121 and a plurality of storage electrode lines131 are formed on an insulation substrate 110 made of transparent glassor plastic.

The gate lines 121 transmit gate signals, and mainly extend in ahorizontal direction. Each gate line 121 includes a plurality of gateelectrodes 124 that protrude downward and a wide end portion 129 forconnection to another layer or an external driving circuit. A gatedriving circuit for generating gate signals may be mounted on a flexibleprinted circuit film that is attached to the substrate 110, that may bedirectly mounted on the substrate 110, or that may be integrated withthe substrate 110. When the gate driving circuit is integrated with thesubstrate 110, the gate lines 121 may be extended to be directlyconnected thereto.

The storage electrode lines 131 receive a predetermined voltage, andhave stem lines extending almost parallel to the gate lines 121 and aplurality of pairs of first and second storage electrodes 133 a and 133b that branch off from the stem lines. Each storage electrode line 131is disposed between two adjacent gate lines 121, and a stem line of thestorage electrode 131 is placed closer to the upper one of the twoadjacent gate lines 121. The storage electrodes 133 a and 133 brespectively include a fixed end connected to the stem line 132 and afree end opposite to the fixed end. The fixed end of the first storageelectrode 133 a has a wide area, and the free end is divided into astraight part and a bent part. However, the shape and arrangement of thestorage electrode lines 121 can be variously changed.

The gate lines 121 and the storage electrode lines 131 can be made of,for example, a copper-based metal such as copper or a copper alloy.However, they may have, for example, a double-layer structure includingtwo layers with physical properties that are different from each other.For example, the upper layer of the two layers may be made of acopper-based metal having low resistivity for reducing a signal delay ora voltage drop, and the lower layer is made of a molybdenum-based metal,chromium, tantalum, or titanium.

The lateral sides of the gate lines 121 and the storage electrode linesare inclined toward the surface of the substrate 110 at an inclinationangle of about 30 degrees to about 80 degrees.

A gate insulating layer 140 made of silicon nitride (SiN_(x)) is formedon the gate lines 121 and the storage electrode lines 131.

On the gate insulating layer 140, a plurality of semiconductors 151 madeof hydrogenated amorphous silicon (abbreviated as hydrogenated a-Si) orpolysilicon are formed. The semiconductors 151 are mainly extend to avertical direction, and include a plurality of projections 154protruding toward the gate electrodes 124. The width of eachsemiconductor 151 extends at a region close to the gate line 121 and thestorage electrode line 131, thereby widely covering the gate line 121and the storage electrode line 131.

A plurality of ohmic contact stripes and islands 161 and 165 are formedon the semiconductors 151. The ohmic contacts 161 and 165 may be made ofa material such as, for example, n+hydrogenated a-Si in which an n-typeimpurity such as phosphor is highly doped, or silicide. The ohmiccontact stripes 161 include a plurality of projections 163, and theprojections 163 and the ohmic contact islands 165 are disposed in pairson the projections 154 of the semiconductors 151.

The lateral sides of the semiconductors 151 and the ohmic contacts 161and 165 are also inclined with respect to a surface of the substrate110, and an inclined angle thereof preferably ranges from about 30degrees to about 80 degrees.

On the ohmic contacts 161 and 165 and the gate insulating layer 140, aplurality of data lines 171 and a plurality of drain electrodes 175 areformed.

The data lines 171 transmit data signals, and mainly extend in avertical direction and cross the gate lines 121. Each of data line 171crosses the storage electrode lines 131 and runs between a set ofadjacent storage electrodes 133 a and 133 b. Each data line 171 includesa plurality of source electrodes 173 extending toward the gate electrode124 to be bent in a “J” shape towards the gate electrode 124. The datalines 171 also include an end portion 179 having a wide area forconnection to another layer or an external driving circuit. A datadriving circuit for generating data signals may be mounted on a flexibleprinted circuit film that is attached to the substrate 110, it may bedirectly mounted on the substrate 110, or it may be integrated with thesubstrate 110. When the data driving circuit is integrated with thesubstrate 110, the data lines 171 may be extended to be directlyconnected thereto.

The drain electrodes 175 are separated from the data lines 171 and facethe source electrodes 173 with the gate electrodes 124 interposedtherebetween. Each of drain electrode 175 has one wide end portion andanother rod-shaped end portion. The wide end portion overlaps thestorage electrode line 131, and the rod-shaped end portion is partiallysurrounded by the source electrode 173.

A gate electrode 124, a source electrode 173, and a drain electrode 175form a thin film transistor (TFT) with the projection 154 of thesemiconductor 151, and the channel of the TFT is formed in theprojection 154 between the source electrode 173 and the drain electrode175.

The data lines 171 and the drain electrodes 175 may be made of, forexample, a copper-based metal such as copper (Cu) or a Cu alloy.However, they may have, for example, a double-layer structure includingtwo layers with physical properties that are different from each other.For example, the upper layer of the two layers may be made of acopper-based metal having low resistivity for reducing a signal delay ora voltage drop, and the lower layer is made of a molybdenum-based metal,chromium, tantalum, or titanium.

The lateral sides of the data lines 171 and drain electrodes 175 arealso inclined toward the surface of the substrate 110 at an inclinationangle of about 30 degrees to about 80 degrees.

The ohmic contacts 161 and 165 exist only between the semiconductors151, the data lines 171, and the drain electrodes 175 to reduce theresistance between them. Although the semiconductor 151 is narrower thanthe data line 171 for the most part, as described above, thesemiconductor 151 becomes wider at a portion where it meets the gateline 121, so that the surface profile becomes smooth to thereby preventthe data line 171 from being cut. Semiconductors 151 have portions thatare exposed without being covered by the data lines 171 and the drainelectrodes 175.

A passivation layer 180 is formed on the data lines 171, the drainelectrodes 175, and the exposed portions of the semiconductors 151. Thepassivation layer 180 may be made of an inorganic insulator such as, forexample, silicon nitride, and its surface may be substantially flat. Aplurality of contact holes 182 and 185 respectively exposing the endportions 179 of the data lines 171 and the drain electrodes 175 areformed in the passivation layer. A plurality of contact holes 181exposing the end portion 129 of the gate line and a plurality of contactholes 183 a exposing a portion of the storage electrode line 131 nearthe fixed end of the first storage electrode 133 a, and a plurality ofcontact holes 183 b exposing projections of the free end of the firststorage electrode 133 a are formed on the passivation layer 180 and thegate insulating layer 140.

A plurality of pixel electrodes 191, a plurality of overpasses 83, and aplurality of contact assistants 81 and 82 are formed on the passivationlayer 180. These members may be made of a transparent conductivematerial such as, for example, indium-tin-oxide (ITO) or indium zincoxide (IZO), or a reflective metal such as, for example, aluminum,silver, chromium, or alloys thereof.

Each of pixel electrode 191 is physically and electrically connected toa drain electrode 175 through a contact hole 185, and a data voltage isapplied to the pixel electrode 191 from the drain electrode 175. Thepixel electrodes 191 are applied with the data voltage to generate anelectrical field together with a common electrode of the other displaypanel to which a common voltage is applied, and thereby determine anorientation of liquid crystal molecules of a liquid crystal layerbetween the two electrodes. The polarization of light passing the liquidcrystal layer changes according to the orientation of the liquid crystalmolecules determined as such. A pixel electrode 191 and the commonelectrode form a capacitor (hereinafter referred to as a liquid crystalcapacitor) to thereby maintain the applied voltage even after the TFT isturned off.

A pixel electrode 191 and a drain electrode 175 connected theretooverlap the storage electrodes 133 a and 133 b and a storage electrodeline 131. A pixel electrode 191 and a drain electrode 175 electricallyconnected thereto overlap a storage electrode line 131 to thereby form acapacitor, and this capacitor is referred to as a storage capacitor. Thestorage capacitor strengthens the voltage-maintaining capacity of theliquid crystal capacitor.

Each of overpass 83 crosses a gate line 121, and is connected to theexposed portion of a storage line 131 and the exposed end portion of thefree end of a storage electrode 133 b through the contact holes 183 aand 183 b that are disposed to be opposite to each other with the gateline 121 interposed therebetween. The storage electrodes 133 a and 133 band the storage electrode lines 131 can be used to fix defects of thegate lines 121, the data lines 171, or the TFT together with theoverpasses 83.

The contact assistants 81 and 82 are connected to the end portion 129 ofthe gate line 121 and the end portion 179 of the data line 171 throughthe contact holes 181 and 182, respectively. The contact assistants 81and 82 supplement connection of the end portions 129 of the gate lines121 and the end portions 179 of the data lines 171 to external devices,and protect them.

A manufacturing method of the TFT of FIG. 3 to FIG. 5 will be describedin further detail with reference to FIG. 6 to FIG. 20.

FIG. 6, FIG. 11, FIG. 14, and FIG. 17 are cross-sectional viewssequentially illustrating a manufacturing process of the TFT array panelaccording to the exemplary embodiment of the present invention, and FIG.7 and FIG. 8 are cross-sectional views of the TFT of FIG. 6, taken alonglines VII-VII and VIII-VIII, respectively. FIG. 9 and FIG. 10 arecross-sectional views respectively illustrating the TFT array panel ofFIG. 7 and FIG. 8 in the next stage of the manufacturing process, FIG.12 and FIG. 13 are cross-sectional views respectively illustrating theTFT array panel of FIG. 11, taken along lines XII-XII and XIII-XIII,FIG. 15 and FIG. 16 are cross-sectional views respectively illustratingof the TFT array panel of FIG. 14, taken along lines XV-XV and XVI-XVI,and FIG. 18 and FIG. 19 are cross-sectional views respectivelyillustrating the TFT array panel of FIG. 17, taken along linesXVIII-XVIII and XIX-XIX.

Referring to FIG. 6 to FIG. 8, on an insulation substrate 110 made of,for example, transparent glass or plastic, a plurality of gate lines 121including gate electrodes 124 and end portions 129 and a plurality ofstorage electrode lines 131 including storage electrodes 133 a and 133 bare formed.

First, a copper (Cu) layer is deposited. At this time, a targetincluding a copper metal is sputtered for deposition of the copper layeron the substrate.

After the copper layer is deposited, a photosensitive film is coated andthen exposed and developed by using a mask, and the copper layer isdry-etched or wet-etched by using the photosensitive film as an etchingmask so as to form a plurality of gate lines 121 and a plurality ofstorage electrode lines 131.

Next, as shown in FIG. 9 and FIG. 10, the gate insulation layer 140 isformed on the entire surface of the substrate 110 through, for example,chemical vapor deposition (CVD).

In this case, the CVD can be performed by supplying, for example, asilicon-containing gas such as silane (SiH₄) or a nitrogen-containinggas such as nitrogen gas (N₂) or ammonia gas (NH₃) together with aninert gas, at a deposition temperature of about 220° C. to about 280° C.At the deposition temperature, the temperature of the substrate can besubstantially increased to about 220° C. to about 250° C.

Subsequently, as shown in FIG. 11 to FIG. 13, a semiconductor layer isstacked and patterned through a photolithography process such that anintrinsic semiconductor 151 including a projection 154 and a pluralityof impurity semiconductor patterns 164 are formed.

A data metal layer made of, for example, copper or a copper alloy isstacked on the impurity semiconductor patterns 164 by using, forexample, a sputtering method.

Referring to FIG. 14 to FIG. 16, the stacked data metal layer ispatterned through the photolithography process so as to form a pluralityof data lines 171 including source electrodes 173 and an end portion 179and a plurality of drain electrodes 175.

Subsequently, portions of the impurity semiconductor patterns 164 thatare exposed without being covered by the data lines 171 and the drainelectrodes 175 are removed so as to form a plurality of ohmic contactstripes 161 including projections 163 and a plurality of ohmic contactislands 165, and portions of the underlying intrinsic semiconductors 154are exposed.

As shown in FIG. 17 to FIG. 19, a passivation layer 180 made of, forexample, silicon nitride is formed and patterned together with the gateinsulation layer 140 so that a plurality of contact holes 181, 182, 183a, 183 b, and 185 respectively exposing the end portion 129 of the gateline 121, the end portion 179 of the data line 171, a portion of thestorage electrode 131 near a fixed end of a first storage electrode 133a, a portion of projections of a free end of the first storage electrode133 a, and the drain electrode 175 are formed. In this case, like thegate insulation layer 140, the passivation layer 180 can be formedthrough the CVD at about 220° C. to about 280° C. by supplying, forexample, a silicon-containing gas or a nitrogen-containing gas.

Subsequently, as shown in FIG. 3 to FIG. 5, a plurality of pixelelectrodes 191, a plurality of contact assistants 81 and 92, and aplurality of overpasses 83 are formed on the passivation layer 180.

Exemplary Embodiment 2

A method for controlling resistance of a copper line by changingdeposition conditions when an insulation layer is deposited on an upperportion of the copper line will be described in further detail.

While maintaining the deposition temperature at a constant level, theamount of silane gas (SiH4) used for the insulation layer deposition isreduced and the density of a silicon nitride (SiN_(x)) layer formed onthe copper line is increased so as to prevent copper-silicide(Cu-silicide) from being formed and to reduce resistance of the copperline.

This is because an atomic ratio of [N]/[Si] within a deposited layer isincreased when the amount of the silane (SiH₄) gas is reduced and theflow amount of a nitrogen-containing gas such as, for example, nitrogengas N₂ or ammonia gas (NH₃) is increased during the insulation layerdeposition. That is, a N-rich SiN_(x) thin film is formed. The N-richSiN_(x) thin film has a high density and has few detects, and thereforesilicon (Si) in the silicon nitride (SiN_(x)) layer can be preventedfrom passing through the silicon nitride (SiN_(x)) layer and beingdiffused inside the copper line.

FIG. 20 and FIG. 21 respectively show a SIMS interface analysis resultof a case in which an N-rich SiN_(x) thin film is deposited on anexposed copper line and of a case in which a typical silicon nitride(SiN_(x)) layer is deposited on the exposed copper line.

As shown in FIG. 20 and FIG. 21, when the N-rich SiN_(x) layer isdeposited, a diffusion distance of the silicon (Si) inside the copperline is shorter than when the typical silicon nitride (SiN_(x)) layer isdeposited. That is, when the high-density N-rich SiN_(x) thin film isdeposited, the deposited silicon nitride (SiN_(x)) layer acts as adiffusion barrier for silicon (Si) more effectively than when thetypical silicon nitride (SiN_(x)) layer is deposited.

Table 4 compares an FT-IR analysis result of the high-density N-richsilicon nitride (SiN_(x)) thin film and the typical silicon nitride(SiN_(x)) layer.

TABLE 4 [N—H]/ [N—H] [Si—H] [Si—H] Typical SiN_(x) layer 1.5E+22~2.0E+225 0E+22~8.0E−21 1.5~2.5 High-density N-rich 2.5E+22~4.0E+22 10E+22~2.0E−21 20~40 SiN_(x) thin film

As shown in Table 4, [N—H] binding numbers of the high-density N-richsilicon nitride (SiN_(x)) thin film are higher than those of the typicalsilicon nitride (SiN_(x)) layer and [Si—H] binding numbers of thehigh-density N-rich silicon nitride (SiN_(x)) thin film are lower thanthose of the typical silicon nitride (SiN_(x)) layer so that a ratio ofthe [N—H]/[Si—H] combining number of the high-density N-rich siliconnitride (SiN_(x)) thin film is significantly high. That is, the ratio ofthe [N—H]/[Si—H] binding number of the high-density N-rich siliconnitride (SiN_(x)) thin film is about 10 times higher than a ratio of the[N—H]/[Si—H] binding number of the typical silicon nitride (SiN_(x))layer.

As described, a high ratio of the [N—H]/[Si—H] binding number impliesthat the amount of nitrogen (N) is relatively high, and accordingly ahigh-density silicon nitride (SiN_(x)) layer is formed.

Therefore, a high-density N-rich silicon nitride (SiN_(x)) layer can beformed by controlling the ratio of the [N—H]/[Si—H] binding number.

However, the typical silicon nitride (SiN_(x)) layer has a highdeposition speed of more than about 20 angstroms (Å)/sec, whereas thehigh-density N-rich silicon nitride (SiN_(x)) layer has a depositionspeed of less than about 15 Å/sec. Therefore, the manufacturing time maybe significantly increased.

Thus, a thin high-density silicon nitride (SiN_(x)) layer is depositedon the substrate and then a typical silicon nitride (SiN_(x)) having ahigh deposition speed is sequentially deposited.

At this time, the thickness of the high-density N-rich silicon nitride(SiN_(x)) layer should be controlled to be greater than a predeterminedthickness. As the thickness of the high-density N-rich silicon nitride(SiN_(x)) layer increases, the manufacturing time increases, therebydecreasing productivity. However, when the high-density N-rich siliconnitride (SiN_(x)) layer is too thin, it may not effectively act as adiffusion barrier so that silicon (Si) may be diffused and react withcopper.

In the present exemplary embodiment of the present invention, thethickness of the N-rich silicon nitride (SiN_(x)) is about 50 to about600 Å, and preferably about 400 to about 600 Å.

Table 5 shows resistance variation of gate wiring and characteristicvariation of a thin film transistor (TFT) in which gate wiring is formedby using copper and a high-density N-rich silicon nitride (SiN_(x))layer deposited on the gate wiring at about 500 Å, and then a gateinsulation layer is formed by depositing a typical silicon nitride(SiN_(x)) layer, thereby forming a TFT.

TABLE 5 DeletedTextsDeletedTexts Resistance Ωη after Cu line formingResistance On- Off- On/Off CVD deposition Glass resistance insulation Ωηafter current current ratio condition No. Ωη layer annealing A(E = 06)A(E−13) (E+07) Deposition of 1 2.35 3.13 3.13 7.09 4.36 1.63 typicalSiN_(x) 2 2.35 2.78 2.82 7.37 5.84 1.26 layer 3 2.37 2.75 3.10 7.77 6.291.24 4 2.34 2.89 3.11 7.83 6.65 1.18 5 2.37 3.10 3.12 7.69 6.43 1.20 62.34 2.92 3.11 7.50 9.22 8.13 Deposition of 1 2.36 2.59 2.57 8.68 7.471.16 typical SiN_(x) 2 2.35 2.62 2.61 8.55 7.28 1.17 layer after 3 2.382.46 2.45 9.37 7.58 1.24 deposition of N- 4 2.32 2.38 2.38 9.03 8.421.07 rich SiN_(x) layer 5 2.35 2.55 2.54 8.23 9.78 8.42 at 500 Å 6 2.342.60 2.60 8.77 8.78 9.99

As shown in Table 5, when the typical silicon nitride (SiN_(x)) layer isdeposited after the high-density N-rich silicon nitride (SiN_(x)) layeris deposited about 500 Å, the resistance of the copper line is moresignificantly reduced then when only the typical silicon nitride(SiN_(x)) layer is deposited. In this case, characteristics of thetransistor are not changed.

A layout view of the TFT array panel formed by using an insulation layerhaving a typical silicon nitride layer formed on a N-rich siliconnitride layer as the gate insulation layer is as shown in FIG. 3, and across-sectional view of the TFT array panel of FIG. 3 is the same asFIG. 4 and FIG. 5.

However, the gate insulation layer 140 formed on the gate lines 121 andthe storage electrode lines 131 is formed by depositing the typicalsilicon nitride (SiN_(x)) layer after forming the N-rich silicon nitride(SiN_(x)) layer having a high density of about 500 Å. In addition, aftersequentially forming the high-density N-rich silicon nitride (SiN_(x))layer and the typical silicon nitride (SiN_(x)) layer, the high-densityN-rich silicon nitride (SiN_(x)) layer may be further formed thereon.The latter N-rich silicon nitride layer may make charges readily move atan interface portion with the intrinsic semiconductor 151, therebyimproving characteristics of the TFT.

Although the above description of an embodiment of the present inventionis limited to the case of the gate lines 121 made of copper and the gateinsulation layer 140 made of silicon nitride, the exemplary embodimentsof the present invention are not limited thereto. For example,application of the spirit of the exemplary embodiments of the presentinvention to the case of data lines 171 made of copper and a passivationlayer 180 made of silicon nitride is also possible. In this case, anN-rich silicon nitride layer may be deposited on a passivation layer 180near the data line 171 and a typical silicon nitride layer may bedeposited thereon.

In addition, although the wiring is made of copper in the abovedescription, the wiring may be made of any metal that can be combinedwith silicon and form silicide.

Having described the exemplary embodiments of the present invention, itis further noted that it is readily apparent to those of reasonableskill in the art that various modifications may be made withoutdeparting from the spirit and scope of the invention which is defined bythe metes and bounds of the appended claims.

1. A method of manufacturing a thin film transistor array panel,comprising: forming a gate electrode including a metal that can becombined with silicon to form silicide on a substrate; forming a gateinsulation layer by supplying a gas which includes silicon to the gateelectrode at a temperature below about 280° C.; forming a semiconductoron the gate insulation layer; forming a data line and a drain electrodeon the semiconductor; and forming a pixel electrode connected to thedrain electrode.
 2. The method of claim 1, wherein the gate linecomprises copper.
 3. The method of claim 2, wherein the gate insulationlayer comprises silicon nitride (SiN_(x)).
 4. The method of claim 2,wherein the forming of the gate insulation layer is performed at atemperature of about 220° C. to about 280° C.
 5. The method of claim 2,wherein when forming the gate insulation layer, the temperature of thesubstrate is in a range of about 220° C. to about 250° C.
 6. The methodof claim 1, further comprising forming a passivation layer by supplyinga gas which includes silicon at a temperature of less than or equal toabout 280° C. after forming the data line and the drain electrode.
 7. Amethod of manufacturing a thin film transistor array panel, comprising:forming a gate electrode including a metal that can be combined withsilicon to form silicide; forming a first silicon nitride layer on thegate electrode by supplying a gas which includes silicon and a gas whichincludes nitrogen; forming a second silicon nitride layer by supplying agas which includes silicon and a gas which includes nitrogen on thefirst silicon nitride layer, wherein a flow amount ratio of the twogases is different from a flow amount ratio supplied for forming thefirst silicon nitride layer; forming a semiconductor on the secondsilicon nitride layer; forming a data line and a drain electrode on thesemiconductor; and forming a pixel electrode connected to the drainelectrode, wherein a [N—H]/[Si—H] binding number ratio of the secondsilicon nitride layer is less than that of the first silicon nitridelayer.
 8. The method of claim 7, wherein the gate line comprises copper.9. The method of claim 8, wherein the first silicon nitride layer has athickness of about 50 to about 600 angstroms (Å).
 10. The method ofclaim 8, wherein a [N—H]/[Si—H] binding number ratio of the firstsilicon nitride layer is about 20 to about 40, and a [N—H]/[Si—H]binding number ratio of the second silicon nitride layer is about 1.5 toabout 2.5.